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XSiL is the world’s leading supplier of laser-machining tools for the MEMS and semiconductor packaging industries, providing high-yield process solutions in the production of thin-silicon devices where current technologies are no longer cost-effective.
      
XSiL's system design and process technology is based on core competencies and capabilities of process development, optical design, mechatronics and system integration. As the world leader in the manufacture and support of laser micro-machining capital equipment for silicon, XSiL's global presence and outlook ensures total customer satisfaction.
        
Dicing
Thin Wafer Dicing
Via Drilling
                
News
        
      
January 18, 2008
Office Opens in Taiwan
      
Following the appointment of Mr. Francis Cheng as Asia-Pacific Manager in June, an office has been recently opened in Taiwan (Hsinchu County). This office will provide sales and technical support for Taiwan and the Asia-Pacific region.
      
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January 16, 2008
SEMICON Japan: Post-Show Report
      
As the previous year, SEMICON Japan was a great success. For XSiL, who presented its latest products at its booth, it was especially rewarding on the topic of 3D interconnect. Tom Narita, Manager of XSiL Japan, gave a talk on laser via drilling at the parallel symposium (STS) and at the seminar organized by EMC-3D.
      
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December 21, 2007
New Executive Vice President
      
Mr. Terry Hannon joined XSiL in December at the position of Executive Vice President. He will be based in Silicon Valley, California.
      
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Taiwan Office
SEMICON Japan 07
Terry Hannon
Upcoming Events 2008
Trade ShowSEMICON West
DateJuly 15 – 17, 2008
LocationSan Francisco, CA
ConferenceIMAPS Device Packaging
DateMarch 17 - 20, 2008
LocationScottsdale, AZ
RoadshowEMC-3D
DateApril 21 - 25, 2008
LocationSouth-East Asia
        
XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland
xm-08-006.0    |    Phone: +353 1 245 7500    |    Fax: +353 1 245 7501    |    Email: info@xsil.com    |    Powered by: go2web