Home   Wafer Dicing   Benefits Typical Results Machining Speed DAF MaxFlex™   Via Drilling   Products   News & Events   About   EMC-3D   Downloads   Careers   Contact Wafer Dicing                   XSiL specializes in thin wafer dicing (thickness below 100 microns). For thin silicon wafers, laser dicing demonstrates high throughput and provides higher yield than traditional methods. The XSiL process includes coating, washing and etching (MaxFlex™) steps all integrated within the tool. The XSiL process is compatible with die-attach films (DAF).          Read more on: Benefits Typical Results Machining Speed DAF MaxFlex                   Laser dicing allows for smaller streets which results in more parts per wafer.        This results in significant increases in fab output and major cost savings in the wafer fab.        Benefits: CAD-controlled beam positioning allows creation of parts of any size or shape:        Ability to cut curvilinear shapes Ability to machine 3D structures such as trenches of controlled depth Multiple product sizes and die types on the same wafer Cuts each die individually, regardless of shape, size or position Allows 100% of the dice on a wafer to be cleanly excised Significant cost savings for prototyping and design verification and batch size cost savings for prototyping and design verification               Dicing multilayered materials & coated wafers:        Enables high-yield dicing and scribing of new materials, complicated layer stacks, and thin wafers including wafers with low-k dielectric Enables dicing thin silicon with high mechanical integrity and no chips Enables dicing wafers with brittle material layers like glass on silicon Enables dicing wafers with thick polymer layers such as wafer scale packages and alpha barriers                             XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland xm-08-006.0    |    Phone: +353 1 245 7500    |    Fax: +353 1 245 7501    |    Email: info@xsil.com    |    Powered by: go2web