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Thin Wafer Dicing: Results
XSiL laser cutting systems are specialized in dicing thin silicon wafers (see
X300D
and
X300D+
).
Parameters
Results for 50µm Si wafers
Machining Speed
From 200mm/s up to 300mm/s
Kerf Width
~24 microns average
Mean Die Strength (after MaxFlex)
>1100MPa
XSiL’s laser dicing system is able to machine thin silicon and die-attach film (DAF) with minimal damage and no chipping.
Blank silicon wafers diced with the X300D+ (left: 50um; right: 75um)
Back to Thin wafer dicing
Machining Speed
Download Application Note on Thin Wafer Dicing
XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland
xm-08-006.0
|
Phone: +353 1 245 7500
|
Fax: +353 1 245 7501
|
Email:
info@xsil.com
|
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