XSiL laser-based processes are the most efficient solutions to dice thin silicon wafers below 100 microns, with or without die-attach film (DAF). Contrary to traditional dicing methods, high machining speeds can be reached, scaling upwards as wafers get thinner. With optimized machining strategies programmed in the tool, downtime resulting from product changeover is minimal. All this leads to increased throughput. High-quality, clean dies with high die strength lead to increased yield. The high yield ensures the lowest cost of ownership.
Benefits:
Minimal chipping
High-yield process
Small kerf width (about 15 microns)
Fast beam steering means laser is constantly cutting — no time wasted doing return feeds
Overall increase in speed and efficiency
Dicing and scribing of multiple layers and materials
Accommodates dice of multiple sizes on the same wafer
High die strength
Features:
Smallest dicelanes available
Dry process does not use water
Ability to cut wafers on tape frame and DAF
All dicing can be done on industry-standard thin wafer compatible tape frames and materials
Patented dicing process
XSiL’s laser system dedicated to thin wafer dicing is theX300D+.Otherdicingprocesses are performed on theX300D.
Laser dicing allows for smaller streets which results in more parts per wafer.
This results in significant increases in fab output and major cost savings in the wafer fab.
Benefits:
CAD-controlled beam positioning allows creation of parts of any size or shape:
Ability to cut curvilinear shapes
Ability to machine 3D structures such as trenches of controlled depth
Multiple product sizes and die types on the same wafer
Cuts each die individually, regardless of shape, size or position
Allows 100% of the dice on a wafer to be cleanly excised
Significant cost savings for prototyping and design verification and batch size cost savings for prototyping and design verification
Dicing multilayered materials & coated wafers:
Enables high-yield dicing and scribing of new materials, complicated layer stacks, and thin wafers including wafers with low-k dielectric
Enables dicing thin silicon with high mechanical integrity and no chips
Enables dicing wafers with brittle material layers like glass on silicon
Enables dicing wafers with thick polymer layers such as wafer scale packages and alpha barriers
