| XSiL laser drilling processes for TSV are extremely flexible and can be utilised for both front end and back end. Being maskless, the laser process eliminates the need for various expensive lithographic steps such as coating, exposure and photoresist stripping. Via positions are programmed by CAD on the tool, enabling rapid setup times, product changeover and significantly reduced cost of ownership (CoO) for large-volume industry. It also gives developers a rapid chip prototyping tool, enabling them to iterate designs quickly from design modifications to machined wafer. |
| Laser drilling creates vias in silicon before seed deposition. These vias will be used for 3D interconnect for chip stacking and MEMS/sensor packaging. |
