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Wafer Dicing
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EMC-3D
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Downloads
Corporate Documents
File type
File Size
Logo
JPG
796 KB
Corporate Profile
Press Kit (EN) 2007
1'340 KB
Press Kit (JP) 2007
3'701 KB
Product Brochures
X300D
X300D+ (EN)
644 KB
X300D+ (JP)
2'601 KB
X300V
X300V-Ultra
X300R
Application Notes
Thin Wafer Dicing
Via Drilling (EN)
2'190 KB
Via Drilling (JP)
5'334 KB
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XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland
xm-08-006.0
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Phone: +353 1 245 7500
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Fax: +353 1 245 7501
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Email:
info@xsil.com
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