Home   Wafer Dicing   Via Drilling   Products   News & Events   About   EMC-3D   Downloads   Careers   Contact EMC-3D          The Semiconductor 3D Equipment and Materials Consortium (EMC-3D) was created in October 2006 to address the technical and cost issues of creating 3D interconnects using through-silicon via (TSV) technology for chip stacking and MEMS/sensor packaging.          The consortium encompasses equipment manufacturers, research institutes and materials manufacturers. XSiL, a founding member of the consortium, belongs to the equipment manufacturer group with its laser drilling technology for producing blind vias in silicon wafers before seed deposition.          EMC-3D members regularly participate in technical conferences and trade shows and also organize roadshows. Please check our News & Events section for more details on upcoming events or visit the consortium’s website: www.emc3d.org          XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland xm-08-006.0    |    Phone: +353 1 245 7500    |    Fax: +353 1 245 7501    |    Email: info@xsil.com    |    Powered by: go2web