 |  | | | Conferences | | | | | | Name | Dates | Location | Participation | Download paper | | IMAPS Device Packaging | March 17-20, 2008 | Scottsdale, USA | Talk on March 19 on thin wafer dicing |  | | IMAPS Device Packaging | March 17-20, 2008 | Scottsdale, USA | Talk on March 18 on laser via drilling | | STS
(Semicon Japan) | Dec. 5-7, 2007 | Tokyo, JP | Invited paper
(Dec. 7 at 3:35PM) | | | be-flexible | Dec. 5-6, 2007 | Munich, DE | Talk on Dec. 5 | | | Electronic Journal Symposium | Octt. 25, 2007 | Tokyo, JP | Invited paper | | | Peaks in Packaging | Sept. 5-7, 2007 | Whitefish, USA | With EMC-3D | | | Laser in Manufacturing (LIM) | June 18-22, 2007 | Munich, Germany | Talk on June 21 | | | IMAPS Device Packaging | March 19-22, 2007 | Scottsdale, USA | Poster with EMC-3D | | | Pan Pacific Conference (SMTA) | Jan. 30 - Feb. 1, 2007 | Hawaii, USA | Talk with EMC-3D | | | SPIE - Photon Processing in Microelectronics and Photonics IV | April 2005 | USA | Invited Paper | | | IWLPC (SMTA) | October 2004 | USA | Presentation | |
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| XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland
| xm-08-006.0 | Phone: +353 1 245 7500 | Fax: +353 1 245 7501 | Email: info@xsil.com | Powered by: go2web |
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