Home   Wafer Dicing   Via Drilling   Products   News & Events   News Press Events Trade shows Conferences Roadshows Awards   About   EMC-3D   Downloads   Careers   Contact News                   January 2008 Office Opens in Taiwan January 2008 SEMICON Japan: Post-Show Report December 2007 New Executive Vice President Based in the U.S. November 2007 XSiL Hires Sales Manager in Korea October 2007 XSiL Impressed Audience at PEAKS in Packaging October 2007 XSiL at SEMICON Taiwan September 2007 New Results in Via Drilling August 2007 XSiL at SEMICON West July 2007 XSiL Launches Next Generation of Laser Dicer for Thin Wafers [JP] June 2007 XSiL Launches Next Generation of Laser Dicer for Thin Wafers June 2007 Dublin Headquarters: New Facilities June 2007 XSiL Announces New Asia-Pacific Regional Manager June 2007 New CEO Appointment June 2004 Hewlett Packard Awards QSA Level II Qualification 2004 March 2003 XSiL launches Next-Generation Laser-Dicing Machine for Semiconductor Manufacturing April 2002 XSiL launched Flagship Laser Processing Solution at Semicon Europa 2002 December 2001 XSiL receives ISO 9001:2000 Certification XSiL Ltd, Silverstone House, Ballymoss Road, Sandyford, Dublin 18, Ireland xm-08-006.0    |    Phone: +353 1 245 7500    |    Fax: +353 1 245 7501    |    Email: info@xsil.com    |    Powered by: go2web