| Dublin, Ireland, August 3, 2007 - Like every year, the semiconductor manufacturers, equipment suppliers and specialized press joined San Francisco for the famous SEMICON show. It was the occasion for XSiL to present its innovative new laser dicing system, the X300D+. Specially designed to singulate very thin wafers, the new system attracted the interest of many. |
The XSIL team from left to right, Peter Conlon Chairman, Delphine Perrottet Technical Marketing Manager, Billy Diggin, VP Business Development and Francis Cheng Sales Manager Asia/Pacific
(Photo from Semiconductor Packaging News) |
| “Xsil has been successfully ramping the production of its X300D+ in response to market demand for the worlds first stand alone, high yield, thin wafer dicing system.” says Brian Farrell, CEO of XSiL Ltd. |
We look forward to welcoming you on our booth at our next Semicon show in Taiwan.
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