| New Results in Via Drilling |
| Dublin, Ireland, September 17, 2007 |
| RE-EVALUATE YOUR CoO FOR TSV |
| Why? Because XSiL has achieved a 50X increase in via drilling rates. |
| How? From significant research and development in our lasers, optics and processes. |
| What are the numbers? Here are the charts. |
| This data represents the drill rates, to various depths, of sets of 33x33 via arrays with 100µm pitch between vias on a silicon substrate. |
What do the vias look like? Check out the SEM images.
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| What does this mean? For example, you could laser drill 100,000 vias of 30µm diameter to a depth of 130µm on a 300mm wafer in less than 3 minutes. This translates into a substantial reduction in cost per die. This is on top of the additional savings that laser drilling provides over other via formation methods, through lower overall capital and consumable costs. |
