| XSiL's laser micro-machining systems are based on our core competencies of process development, optical and laser systems design, mechatronics and system integration. XSiL’s technology is dedicated to the semiconductor and microelectronic industries, with products developed specially for dicing, drilling, scribing and other micro-machining processes. |
| | Fully Automatic Laser Dicing | | Integrated Coating & Wash Processes | | 355nm & 532nm Laser Options | | Small Die Machining (e.g., LEDs) | | Non-Standard Dicing (solar, medical) |
| | | Fully Automatic Laser Dicing | | Specific for Thin Wafer & DAF | | Integrated Coating & Wash Processes | | Integrated MaxFlex™ | | 355nm 20W Laser | | Memory, Power Devices, etc. |
| | | Fully Automatic Via/MEMS Machining | | Integrated Coating & Wash Processes | | 355nm & 532nm Laser Options | | ≥ 30µm diameter | | Through or Blind Vias machined on top or bottom side of wafer |
| | | Fully Automatic Via Machining | | Integrated Coating & Wash Processes | | Enhanced Optics & XY Stage | | 15µm Blind Vias | | 355nm Laser | | Specifically designed to machine interconnecting Vias |
| | | Semi-Automatic Laser Machining | | 266nm, 355nm & 532nm Laser Options | | Designed for General Purpose R & D | | Wafer resizing & dicing, via drilling, other micro-machining | | Suitable for Process Development |
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All systems in the X300 Series are up to 300mm capable and can handle bare wafer or frames.
All systems in the X300 Series feature X-Cam, a software design package that uploads standard CAD files to enable controlled laser processing of 2D layouts and 3D structures. |
